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Saturday, March 10, 2012

The 3rd Asian Symposium on Materials & Processing - IIT Madras

About the Symposium
The 3rd Asian Symposium on Materials & Processing, ASMP 2012 will be held from August 30 to 31, 2012 in Chennai, India. This is the 3rd in the series of ASMP (1st and 2nd were held in Bangkok, Thailand and Penang, Malaysia, respectively). The aim of the symposium is to enhance mutual cooperation for higher research level and activity in the fields of Materials and Processing Engineering in Asian region.

The Symposium will become a perfect platform to share, discuss and exchange ideas on the latest development and recent findings in research studies related to advanced materials and processing among international participants.

Papers are invited in areas related to the following from prospective authors:
Advanced materials
Metals, Ceramics, Polymers and Composites
Smart Materials and Structures, Functional Materials
Surface Engineering, Thin Films and Coatings
Materials Processing, Forming, Casting and Machining
Powder Metallurgy, Adhesion and Interface, Welding and Bonding
Nanofabrication and Nano/Micro/Meso Manufacturing Processes
Advanced Manufacturing
Micro and Nano Technology in Materials and Processing
Mechanical Properties, Fracture and Reliability
Dynamic Behavior of Materials and Structures
Materials Characterization and Measurement Techniques
Non-Destructive Testing and Evaluations, Monitoring and Sensing Technology
Modeling, Analysis and Simulation in Materials and Processing

Authors are invited to submit an abstract NOT exceeding 300 words and must include the following information:
  • Title of the paper, full name, email and affiliation of author(s)
  • Five Keywords
  • Format of abstract can be downloaded here

Note : Authors can submit papers to the special issue on Recent Advances in Materials and Processing (ASMP2012) of Journal of Solid Mechanics and Materials Engineering (JSME International Journal)

Source : http://www.mme.iitm.ac.in/asmp2012/index.html Or http://www.asmp2012.com/

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