About the Symposium
The 3rd Asian Symposium on Materials & Processing, ASMP 2012 will be held from August 30 to 31, 2012 in Chennai, India. This is the 3rd in the series of ASMP (1st and 2nd were held in Bangkok, Thailand and Penang, Malaysia, respectively). The aim of the symposium is to enhance mutual cooperation for higher research level and activity in the fields of Materials and Processing Engineering in Asian region.
The Symposium will become a perfect platform to share, discuss and exchange ideas on the latest development and recent findings in research studies related to advanced materials and processing among international participants.
Papers are invited in areas related to the following from prospective authors:
Advanced materials | |
Metals, Ceramics, Polymers and Composites | |
Smart Materials and Structures, Functional Materials | |
Surface Engineering, Thin Films and Coatings | |
Materials Processing, Forming, Casting and Machining | |
Powder Metallurgy, Adhesion and Interface, Welding and Bonding | |
Nanofabrication and Nano/Micro/Meso Manufacturing Processes | |
Advanced Manufacturing | |
Micro and Nano Technology in Materials and Processing | |
Mechanical Properties, Fracture and Reliability | |
Dynamic Behavior of Materials and Structures | |
Materials Characterization and Measurement Techniques | |
Non-Destructive Testing and Evaluations, Monitoring and Sensing Technology | |
Modeling, Analysis and Simulation in Materials and Processing |
Authors are invited to submit an abstract NOT exceeding 300 words and must include the following information:
- Title of the paper, full name, email and affiliation of author(s)
- Five Keywords
- Format of abstract can be downloaded here
Note : Authors can submit papers to the special issue on Recent Advances in Materials and Processing (ASMP2012) of Journal of Solid Mechanics and Materials Engineering (JSME International Journal)
Source : http://www.mme.iitm.ac.in/asmp2012/index.html Or http://www.asmp2012.com/
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